ROADMAP ____EDADOC|一博电路

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【大中小】

YEAR		2011	2012
Materials	PTFE multilayer	M	M
	Halogen free	M	M
	Hybrid Material	M	M
	Metal-based	M	M
	Heat sink PCB	M	M
	PPO	M	M
	Ceramic filler	M	M
	Ceramic based	2 sides D	LTCC D
Max. layer	Layer counts	64 P	64 M
Min line/Spce	Inner layer 3/3mil	3/3mil M	2/2mil P M
Min line/Spce	Outer layer 4/3mil	3/3mil P	3/3mil P M
Board Thickness	330mil	400mil D	1000mil D
Min mechanical hole	8mil	6mil P	6mil M
Max aspect ratio	16:1	18:1 M	20:1 M
Buried resistor		P	M
Buried capacitance		M	M
Controlled impedance	±10%	M	M
Controlled impedance	±5%	P	M
HDI	1+C+1	M	M
HDI	2+C+2	M	M
Surface finishing	HASL; Im-gold; Gold finger; OSP	M	M
New product		Rigid-flex hybrid, Heavy copper(>6oz)
P = Prototype M = mass production D = under development